Transactions on CPMT

IEEE Transactions on Components, Packaging and Manufacturing Techology

Components, Packaging and Manufacturing Technology, IEEE Transactions on

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The Transactions on Components, Packaging and Manufacturing Technology, first published in January 2011, is a merger of three CPMT Transactions: the Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies and Transactions on Electronics Packaging Manufacturing. Read more....

Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

Frequency

Published on-line in IEEE Xplore monthly and combine two months of online content into the print edition for six print issues per year.

Subscription Rates (in USD)

	Online	Print	Combo (Online/Print)
CPMT Member	included in membership	$25	n/a
CPMT Student Member	included in membership	$13	n/a
IEEE Member	$45	$50	$60
Non-Member	$1185	$1365	$1640

Note: Subcribers to the Transactions on CPMT have online access to all CPMT predecessor journals (including the most recent Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies, and Transactions on Electronics Packaging Manufacturing) -- going back to 1954.

Managing Editor R. Wayne Johnson Laboratory for Electronics Packaging and Assembly Auburn University Auburn, AL USA phone: +1 334 844 1880	Co-Editor - Packaging Technologies Kuo-Ning Chiang National Tsing Hua University Department of Power Mechanical Engineering Hsinchu, Taiwan phone: 886 3 5742925
Co-Editor - Advanced Packaging Ravi Mahajan Advanced Packaging Intel Chandler, AZ USA phone: +1 480 554 371	Co-Editor - Components: Characterization and Modeling Koneru Ramakrishna Components: Characterization and Modeling Austin, TX USA
Co-Editor - Electrical Performance of Integrated Systems Jose E Schutt-Aíne University of Illinois at Urban Champaign Electrical and Computer Engineering Urbana, IL USA phone: +1 217 244 7279	Co-Editor -Electronics Manufacturing R. Wayne Johnson Laboratory for Electronics Packaging and Assembly Auburn University Auburn, AL USA phone: +1 334 844 1880