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Transactions on CPMT

IEEE Transactions on Components, Packaging and Manufacturing Techology

Components, Packaging and Manufacturing Technology, IEEE Transactions on
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The Transactions on Components, Packaging and Manufacturing Technology, first published in January 2011,  is a merger of three CPMT Transactions: the Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies and Transactions on Electronics Packaging Manufacturing.  Read more....

Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

Frequency

Published on-line in IEEE Xplore monthly and combine two months of online content into the print edition for six print issues per year.

Subscription Rates (in USD)

Online         
Print          
Combo
(Online/Print)
CPMT Member included in membership
$25 n/a
CPMT Student Member included in membership
$13 n/a
IEEE Member $45 $50 $60
Non-Member $1185 $1365 $1640

 

 

 

 

 

 

 

Note:  Subcribers to the  Transactions on CPMT have online access to all CPMT predecessor journals (including the most recent Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies, and Transactions on Electronics Packaging Manufacturing) -- going back to 1954.

 

Managing Editor

Electrical and Computer Engineering Department
Tennessee Tech University
Cookeville, TN
phone: +1 931 372 3430

Co-Editor - Packaging Technologies

Kuo-Ning Chiang
National Tsing Hua University
Department of Power Mechanical Engineering
Hsinchu,  Taiwan
phone: 886 3 5742925

Co-Editor - Advanced Packaging

Ravi Mahajan
Advanced Packaging
Intel
Chandler, AZ  USA
phone: +1 480 554 371

Co-Editor - Components: Characterization and Modeling

Koneru Ramakrishna
Components: Characterization and Modeling
Austin, TX   USA

Co-Editor - Electrical Performance of Integrated Systems

Jose E Schutt-Aíne
University of Illinois at Urban Champaign
Electrical and Computer Engineering
Urbana, IL  USA
phone: +1 217 244 7279

Co-Editor -Electronics Manufacturing

Electrical and Computer Engineering Department
Tennessee Tech University
Cookeville, TN
phone: +1 931 372 3430