TC - High Density Substrates & Boards
Chair: Venky Sundaram, Georgia Tech Packaging Research Center, USA
Co-Chair:Yasumitsu K Orii, IBM, Japan
Focus: High-speed and high-density interconnect technologies, based on advanced material-, process-, structure-, and design-technologies. Application areas are ICTs, mobile electronics, automobiles/power electronics, and healthcare.
Activities: Organizes CPMT Seminar at ECTC (2012 - "Coreless substrate technologies").
Committee Meetings: At ECTC and Septmber in Tokyo.