TC - High Density Substrates & Boards


Chair
Venky Sundaram, Georgia Tech Packaging Research Center, USA

 

Co-Chair:Yasumitsu K Orii, IBM, Japan

 

Focus: High-speed and high-density interconnect technologies, based on advanced material-, process-, structure-, and design-technologies. Application areas are ICTs, mobile electronics, automobiles/power electronics, and healthcare.

 

Activities:  Organizes CPMT Seminar at ECTC (2012 - "Coreless substrate technologies").

 

Committee Meetings:  At ECTC and Septmber in Tokyo.