TC - Electrical Design, Modeling & Simulation


Chair
:Dale Becker, IBM, USA (View Bio)

 

Co-Chair: TBD

 

Website: http://www.ewh.ieee.org/soc/cpmt/tc12/index.html

 

Focus: All aspects of electrical design as it relates to Signal Integrity, Power Integrity, Electromagnetic Interference, electromagnetic modeling, multi-physics analysis, Design Tools, System level issues and High Frequency Measurements with emphasis on digital, RF, optoelectronics, microwave and mixed signal electronics.

 

Activities:  Orgnaizes three major conferences every year:  1) Electrical Performance of Electronic Packaging and Systems (EPEPS); 2) Signal and Power Integrity (SPI) and 3) Electrical Design of Advanced Packaging and Systems (EDAPS) . In additon, participates in organizing the modeling sessions at ECTC.

 

Committee Meetings:  At EPEPS.