Heterogeneous Integration Roadmap
Following SIA's closure of ITRS activities in 2015, the Heterogeneous Integration Roadmap activities will continue -- sponsored by the IEEE Components, Packaging and Manufacturing Technology Society (CPMT), SEMI, IEEE Electron Devices Society (EDS), IEEE Photonics Society and the ASME EPPD Division, with the intention of expanding the roadmap collaboration to other IEEE Technical Societies that share interest in the Heterogeneous Technology Roadmap as well as to organizations outside IEEE that share this common vision for the roadmap.
The ITRS Assembly and Packaging Working Group has had many years of history of collaboration with the IEEE Societies in holding workshops and work sessions at IEEE Societies sponsored conferences and events around the world. The basis of this collaboration is the common shared interest in a Technology Roadmap for the IEEE Societies’ membership, conference attendees and participants in the ITRS Technical Working Group work sessions. IEEE Societies Conferences are high profile forums on the latest research and development in Packaging, Interconnect, Test and the materials, processes and equipment supporting this R&D. The Roadmap workshops of the ITRS had provided an opportunity for the participants to review the directions of these technologies and build a technology Roadmap looking 15 years into the future.
The collaboration in technical working groups (TWGs) that produced the ITRS Roadmap has continued with the establishment of the Heterogeneous Integration Focus Team in 2014. In 2015, a MOU was signed between the Heterogeneous Integration Focus Team and the IEEE CPMT Society with the approval of the Semiconductor Industry Association (SIA) to ensure the collaboration was sustainable.
In the winter of 2015, SIA announced that it would bring the ITRS activities to a close with the publication of the 2015 Edition in the spring of 2016.
We believe that it is important to continue this Heterogeneous Integration Roadmap function for the profession, industry and the entire technical community. In the era of IoT, the Cloud, smart phones and intelligent automobiles, there is immense need for a pre-competitive technology roadmap providing a long term vision to the future and identifying difficult challenges and potential solutions.
Bringing this mission under the auspices of the IEEE Technical Societies will fill this important need with the deep knowledge base from the Societies’ global membership and worldwide network. It would be a service to the global technical professionals and technical community consistent with the IEEE mission. The goal for this roadmap is to be open and transparent. IEEE CPMT provides institutional sponsorship to ensure sustainability and quality.The Heterogeneous Integration Roadmap activities are sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), SEMI, IEEE Electron Devices Society (EDS), IEEE Photonics Society and the ASME EPPD Division with the intention of expanding the roadmap collaboration to other IEEE Technical Societies that share interest in the Heterogeneous Technology Roadmap as well as to organizations outside IEEE that share this common vision for the roadmap. A document with definition of the mission, purpose, structure and governance for this Heterogeneous Integration Roadmap program was prepared and approved.
Heterogeneous Integration refers to the integration of separately manufactured components into a higher level assembly (SiP) that, in the aggregate, provides enhanced functionality and improved operating characteristics.
In this definition components should be taken to mean any unit whether individual die, MEMS device, passive component and assembled package or sub-system that are integrated into a single package. The operating characteristics should also be taken in its broadest meaning including characteristics such as system level performance and cost of ownership.
The mission of this Heterogeneous Integration Roadmap is to provide guidance to the profession, industry, academia and government to identify key technical challenges with sufficient lead time that they do not become roadblocks preventing the continued progress in electronics. That progress is essential to the future growth of the industry and the realization of the promise of continued positive impact on mankind. The approach is to identify the requirements for heterogeneous integration in the electronics industry through 2031, determine the difficult challenges that must be overcome to meet these requirements and, where possible, identify potential solutions.
The Roadmap serves as a guideline for the global electronics industry of projected technology needs and opportunities for innovation.
The Roadmap is devised and intended for technology assessment only and is without regard to any commercial considerations pertaining to individual products or equipment.
Serving the Profession, Industry, Academia and Research Institutes, the Roadmap provides:
A forecast of industry requirements to maintain the pace of progress for the industry and user community over the next 15 years, and the next 25 years for the heterogeneous integration of emerging devices and materials which require a longer research development horizon.
Identification of difficult challenges that must be addressed to meet these industry requirements.
- Where possible the Roadmap will identify research requirements and potential technical solutions.
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An International Roadmap Committee (IRC) has been established by the sponsoring organizations, under the oversight of the CPMT Society.
The IRC will initially be a group of ~6 people with representation from CPMT, EDS, SEMI and other IEEE and non-IEEE collaborating organizations, government and academia.
The Chairman of the IRC will be named by the CPMT President.
The IRC will meet at least quarterly and publish minutes of the meetings.
The IRC will determine the Technical Working Groups (TWGs) that will be established to develop chapters of the Roadmap, appoint the TWG Chairs and approve the mission and scope statements of each Roadmap chapter.
TWG chairs will be responsible for recruiting the appropriate volunteers to address the scope of their Roadmap chapters.
The Roadmap will participate in the same peer review and quality control procedures as other IEEE publications.
- The schedule and location of meetings at Society Conferences will be determined by the IRC for:
- In person meetings of the full Roadmap membership
- On-line meetings for all TWG Chairs
TWG Chairs will schedule in person meetings and on-line meetings for their members working sessions and share their schedule with the IRC.
The IRC will determine the schedule for preparation and publication of the Roadmap.
The Current members of the International Roadmap Committee are: Bill Chen, Chair ; Bill Bottoms (IEEE CPMT Society); Tom Salmon (SEMI), Subramanian Iyer (IEEE EDS), Amr Helmy (IEEE Photonics Society) and Ravi Mahajan (ASME EPPD Division). Gamal Refai-Ahmed is the ASME EPPD alternate.
An Executive Committee (EC) will be formed within the IRC to facilitate operation.
- The CPMT Society will maintain the Roadmap web pages.
This Roadmap’s processes will be transparent and the work product will be published on the
The IEEE CPMT Heterogeneous Integration Roadmap will address the assembly & packaging, test and interconnect technologies required to meet industry needs over the next 15 years. The scope statement refers specifically to the 2016 edition of this Roadmap. It will be revised for each addition to define the changing scope of the Roadmap over time.
Packaging is the final manufacturing process transforming devices into functional products for the end user. Packaging must provide electrical and photonic connections for signal input and output, power input, and voltage control. It also provides for thermal dissipation and the physical protection required for reliability. The rise of the Internet of Things (IoT), movement to the cloud of data logic and applications, the slowing of Moore’s Law scaling for CMOS and the realization that transistors at the geometries to be used will wear out all place new demands on the industry.
Design concepts, packaging architectures, device types, materials, manufacturing processes and systems integration technologies are all changing rapidly. These innovations have resulted in development of several new technologies as well as expansion and acceleration of technologies introduced in prior years. Heterogeneous integration with wireless and mixed signal devices, bio-chips, power devices, optoelectronics, and MEMS in a single package is placing new requirements on the industry as these diverse components are introduced as elements for System-in-Package (SiP) architectures.
The scope or the Heterogeneous Integration Roadmap is identification of the difficult challenges and the potential solutions for meeting technical requirements for the next 15 years and 25 years for emerging research areas. The primary integration technology for the potential solutions will be complex, 3D System in Package (SiP) architectures.
The IRC is preparing an initial list of TWGs being considered.
- Heterogeneous Integration Components
- Single Chip and Multi Chip Packaging (including Substrates)
- Integrated Photonics
- Integrated Power Devices
- RF and Analog Mixed Signal
- Cross Cutting topics
- Emerging Research Materials
- Emerging Research Devices
- Integration Processes
- 3D +2.5D
- WLP (fan in and fan out)
- HI and Packaging for Specialized Applications
- High Performance Computing
- IoT and Wearable
- Medical and Health
- Aerospace and Defense
- Co-Design and Simulation
2017 SCHEDULE OF HIR WORKSHOPS
The International Roadmap Committee has arranged for a series of face-to-face workshops around the world. This is done so that members of the TWGs will find it easy to attend at least one face-to-face meeting to support collaboration during Roadmap preparation by developing personal relationships. It is not intended that all TWG members attend each workshop although they will be invited. The list of workshops and the sponsoring organizations for each one is listed below.
2. ECTC Orlando, FL, USA 5/30-6/04
3. NordPac Gothenburg, Sweden 6/18-20
4. Palo Alto Workshop before SEMICON WEST, Palo Alto, CA, USA 7/9
5. SEMICON WEST San Francisco, CA USA 7/10
6. InterPACK (ASME) San Francisco, CA, USA 8/29-9/1
7. ELECTRONICS PACKAGING SYMPOSIUM , Niskayuna NY, USA 9/19-20
8. IEEE PHOTONICS CONFERENCE Lake Buena Vista, FL, USA, 10/1-5
9. IMPACT Taipei, Taiwan 10/25-26
10. SEMICON Europa Munich, Germany 11/14-17
11. ICSJ Kyoto, Japan 11/20-22
13. EPTC Singapore 12/3-5
14. IEDM San Francisco, CA USA 12/4-6
15. Workshops under planning
D. Joint Society Chapters Workshop, CA USA Nov/Dec
- ECTC + ITHERM Las Vegas, NV USA 05/31- 06/04
- Palo Alto Workshop before SEMICON WEST (3101 Alexis Drive, Palo Alto. CA ) 07/10
- SEMICON WEST San Francisco, CA USA 07/11
- Nagase R&D Center Tokyo, Japan 8/9
- ITRI Taiwan 8/12
- ICEPT Wuhan, China 8/16
- ESTC Grenoble, France 09/13-16
- IEMT-EMAP Penang, Malaysia 9/20
- Electronics Packaging Symposium Binghamton, NY USA 10/5-8
- IMPACT Taipei, Taiwan 10/26-28
- ICSJ Kyoto, Japan 11/7-9
- MEPTEC Heterogeneous Integration Roadmap Symposium San Jose CA 11/14
- EPTC Singapore 11/30-12/03
- IEDM San Francisco CA 12/3-7
There are 3 additional workshops that are planned for Asia in August. They are:
1. Taiwan (at ITRI - 08/12)
2. China (associated with ICEPT in Wuhan, China 08/16-19)
3. Japan Tokyo 08/9
A number of presentations on Roadmap activities are planned in addition to the workshops. The presentations scheduled to date are:
(updated: 8 February 2017)