IEEE Transactions on Components, Packaging and Manufacturing Technology

READ: "How to Write for Technical Periodicals & Conferences" Call for Papers:  Special Section on Nanopackaging

 

IEEE Transactions on Components, Packaging and Manufacturing Technology 

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The Transactions on Components, Packaging and Manufacturing Technology, first published in January 2011,  is a merger of three CPMT Transactions: the Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies and Transactions on Electronics Packaging Manufacturing.  Read more....

 

Scope 

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

Frequency

Published on-line in IEEE Xplore monthly and combine two months of online content into the print edition for six print issues per year.

Subscription Rates (in USD)

 Online          Print           
Combo
(Online/Print)
CPMT Member included in membership $25 n/a
CPMT Student Member included in membership $13 n/a
IEEE Member $45 $50 $60
Non-Member $1185 $1365 $1640

Note:  Subcribers to the  Transactions on CPMT have online access to all CPMT predecessor journals (including the most recent Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies, and Transactions on Electronics Packaging Manufacturing) -- going back to 1954.

  

 

Managing Editor

Electrical and Computer Engineering Department
 
Tennessee Tech University
Cookeville, TN
phone: +1 931 372 3430

Co-Editor - Advanced Packaging Technologies

Kuo-Ning Chiang
National Tsing Hua University 
Department of Power Mechanical Engineering 
Hsinchu,  Taiwan 
phone: 886 3 5742925

Co-Editor - Special Topics

Ravi Mahajan
Advanced Packaging
Intel 
Chandler, AZ  USA
phone: +1 480 554 371

Co-Editor - Components: Characterization and Modeling

Koneru Ramakrishna
Components: Characterization and Modeling
Austin, TX   USA 

Co-Editor - Electrical Performance of Integrated Systems

Jose E Schutt-AĆ­ne
University of Illinois at Urban Champaign 
Electrical and Computer Engineering 
Urbana, IL  USA
phone: +1 217 244 7279

Co-Editor -Electronics Manufacturing

Electrical and Computer Engineering Department
Tennessee Tech University
Cookeville, TN
phone: +1 931 372 3430