IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
Published on-line in IEEE Xplore monthly and combine two months of online content into the print edition for six print issues per year.
Subscription Rates (in USD)
|CPMT Member||included in membership||$25||n/a|
|CPMT Student Member||included in membership||$13||n/a|
Note: Subcribers to the Transactions on CPMT have online access to all CPMT predecessor journals (including the most recent Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies, and Transactions on Electronics Packaging Manufacturing) -- going back to 1954.
|+1 931 372 3430||
National Tsing Hua University
Department of Power Mechanical Engineering
886 3 5742925
Chandler, AZ USA
+1 480 554 371
Components: Characterization and Modeling
Austin, TX USA
Jose E Schutt-Aíne
University of Illinois at Urban Champaign
Electrical and Computer Engineering
Urbana, IL USA
+1 217 244 7279
|+1 931 372 3430|