Outstanding Sustained Technical Contribution Award

Nominations Period for 2013 CPMT Society Awards is closed

Purpose:

To recognize outstanding sustained and continuing contributions to the technology in fields encompassed by the CPMT Society.

Award:

US$2,500 and Certficate

Basis for Judging:

Technical contributions must be sustained and continuing over a period of at least five (5) and preferably 10 years. One major contribution will not qualify. Must be documented by open literature publications such as papers, patents, books and reports (available to the public).

Eligibility:

Recipient must be a current member of IEEE and CPMT, and have been a member of IEEE and CPMT for at least the past three years.

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Download Nomination Form (.doc)

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2013 RECIPIENT

Dongkai Shangguan

National Center for Advanced Packaging, China

For 20 years of technical leadership, especially in the areas of of lead-free and

environmentally conscious electronics and advanced microelectronics packaging

and assembly technologies for product miniaturization and functional densification.

PAST RECIPIENTS

2013 Tseung-Yuen Tseng

for outstanding sustained contributions in passive component, electronic ceramicand nanoceramic technologies.

2011 John Lau

for a decades-long record of developing and communicating packaging platform, material and process advancements through research and development leadership, publications and professional training.

2010 Frank Shi

for his accomplishments in multiple fields including optoelectronic packaging technology development, device and packaging materials development, electronic packaging and manufacturing technology development; and his leadership in the technology transfer of these developments from a research environment to an industrial commercialization and production environment.

2009 Moises Cases

for expertise in system level electrical packaging design and integration, including system level timing for high performance digital systems encompassing multiple boards and cable subsystems.

2008 Jianmin Qu

for his significant impact on the electronic packaging industry through 15 years of research and development in micro-electronic packaging, primarily in reliability modeling and analysis, resulting in one book, nine book chapters, 90 publications in refereed journals, and 110 conference presentations.

2007 Philip E. Garrou

for 25 years of technical contributions and leadership in thin film dielectric materials and microelectronic applications including multichip modules, bumping and wafer level packaging, integrated

2006 Jorma Kivilahti 

for contributions to the development of novel electronic and opticalintegration techniques and the reliability of electronic products.

2005 I. Charles Ume     

for his contributions to thermomechanical reliability in electronic packaging.

2004 Luu T. Nguyen       

for his major contributions in wafer level packaging, lead-free packaging, and for research collaboration and technology transfer in the area of electronic packaging.

2003 Thiam Beng Lim            

for his leading edge research in advanced packaging technologies, and for managing and transferring the electronic packaging research and development to industry and other research organizations worldwide.

2002 Avram Bar-Cohen         

2001 George Harman           

2000 Ephraim Suhir           

1999 Toshi Watari            

1998 Kanji Otsuka      

1996 Leonard Schaper                 

1995 C.P. Wong               

  (CHMT OUTSTANDING SUSTAINED TECHNICAL CONTRIBUTION AWARD)

1994 Takaaki Ohsaki          

1993 Rao R. Tummala          

1992 Peter M. Hall