Members Only


The CPMT Members Only area delivers technical content from a variety of sources to Society members -- as a membership benefit.  Content may include selected presentations from regional conferences, Chapter workshops,seminars and meetings; announcements of upcoming CPMT Webinars and recordings of past CPMT Webinars; and special offers.  View recordings (if available) and presentation files.

 

Upcoming Webinars

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Past Webinars

 
 

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IEEE CPMT Webinar: Interconnect Materials in Electronic Packaging

Date
2016-08-10
Location
Webinar - Online
Contact
Marsha Tickman – m.tickman@ieee.org
Description

Electronic packaging comprises combination of hybrid compartments including silicon chip, encapsulation, substrate, lead frame, printed circuit board, etc. The enclosure of all of these compartments need appropriate interconnects (I/O) to enable the functions of the electronic products. The interconnect technologies and materials adopted depend on the level of packaging. This presentation will go through the interconnect materials for the chip level, module level, and board level packaging. The interconnect materials and technologies to be discussed include wire bonding, solder bumping, copper pillar, TSV, solder ball, solder paste, and wave soldering.

Log-in instructions will be sent to registered attendees via email 1-2 days before the event takes place.

Event Recording

 

Technical Presentations

 
Annual IEEE-SCV Soft Error Rate (SER) Workshops (Recordings and/or Presentations from Workshops held 2009-2014)
IEEE Santa Clara Valley CPMT Society Chapter Workshop (with Reliability and Electron Devices Chapters) 
A unique forum for component manufacturers, assembly houses, and electronic system manufacturers to exchange innovative ideas and recent results on the measurement, monitoring, and control of alpha emission from packaging materials and manufacturing processes. Covers a wide range of areas and subjects critical to the control and mitigation of device soft error rates.
 

July 2013 at SEMICON West 2013

IEEE/CPMT Workshop in: Thin Is In: Thin Chip & Packaging Technologies as Enabler for Innovative Mobile Devices
July 2012 at SEMICON West 2012

CPMT Orange County Workshop, December 9, 2011, Newport Beach, CA. USA