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Best Paper Awards

 

The CPMT Society recognizes the best papers published in its Transactions each year.  Selection of best papers is made by the Editors-in-Chief and Associate Editors.

 

Transactions on Components, Packaging and Manufacturing Technology Best Paper Award Recipients

Components: Characterization and Modeling Category:

2012 “Microstructurally Adaptive Model for Primary and Secondary Creep of Sn-Ag-Based Solders” Praveen Kumar, Zhe Huang, Sri Chaitra Chavali, Dennis K. Chan, Indranath Dutta, Ganesh Subbarayan, and Vikas Gupta;  Volume 2  Number 2, February 2012

2011 "Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints" Richard Coyle, John Osenbach, Maurice N. Collins, Heather McCormick, Peter Read, Debra Fleming, Richard Popowich, Jeff Punch, Michael Reid, and Steven Kummerl; Volume 1 Number 10, October 2011

Electrical Performance of Integrated SystemsCategory:

2012 “Extension of the Contour Integral Method to Anisotropic Modes on Circular Ports” Xiaomin Duan, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, and Christian Schuster; Volume 2  Number 2, February 2012

2011 "Efficient Implicit–Explicit Time Stepping Scheme With Domain Decomposition for Multiscale Modeling of Layered Structures" Jiefu Chen, Luis Eduardo Tobon,  Mei Chai,  Jason A. Mix, and Qing Huo Liu; Volume 1 Number 9, September 2011

Predecessor Publications (Prior To Merger In 2011)

Transactions on Components and Packaging Technologies Best Paper Award Recipients

2010   "Development of 3-D Silicon Module With TSV for System in Packaging” by Navas Khan, Vempati Srinivasa Rao, Samuel Lim, Ho Soon We, Vincent Lee, Xiaowu Zhang, E. B. Liao, Ranganathan Nagarajan, T. C. Chai, V. Kripesh and John H. Lau ; VOL. 33, NO. 1, March 2010

2009   "Effect of Permittivity and Permeability of a Flexible Magnetic Composite Material on the Performance and Miniaturization Capability of Planar Antennas for RFID and Wearable Wireless Applications"  by Lara J. Martin, Sooliam Ooi, Daniela Staiculescu, Michael D. Hill, C. P. Wong, and Manos M. Tentzeris;  VOL. 32, NO. 4, December 2009

2008   “Interfacial Delamination Mechanisms during Soldering Reflow with Moisture Preconditioning”, by Xuejun Fan, G.Q. Zhang, Willem D. van Driel, Leo J. Ernst, VOL. 31, NO. 2, June 2008

2007   “A Practical Implementation of Silicon Microchannel Coolers for High Power Chips,” by Evan G. Colgan, Bruce Furman, Michael Gaynes, Willian S. Graham, Nancy C. LaBianca, John H. Magerlein, Robert J. Polastre, Mary Beth Rothwell, R. J. Bezama, Kenneth C. Marston, Hilton Toy, Jamil Wakil, Jeffrey A. Zitz, Rehan Choudhary, Roger R. Schmidt, VOL. 30, NO. 2, June 2007

2006   “On-chip high speed localized cooling using superlattice microrefrigerators” by Yan Zhang, James Christofferson, Ali Shakouri, Gehong Zeng, John E. Bowers, Edward T Croke, VOL. 29, NO. 2, June 2006

2005   "Increasing the Accuracy of Structure Function Based Thermal Material Parameter Measurements" by Márta Rencz , András Poppe, Ernõ Kollár, Sándor Ress, Vladimir Székely, VOL. 28, NO.1 , March 2005 issue

2004   “Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages” by Eric Stellrecht, Bongtae Han, Michael G. Pecht, VOL. 27,  NO. 3,  September 2004

2003   "Thermal Management of BioMEMS: Temperature Control for Ceramic-based PCR and DNA Detection Devices” by Daniel J Sadler, Rajnish G,  Changrani, Peter C Roberts,Chia-Fu Chou, Frederic Zenhausern,  VOL. 26,  NO. 2,  June 2003

2002   "Experimental and Theoretical Characterization of an Antiferroelectric Ceramic Capacitor of Power Electronics," Jacobus D. van Wyk coauthored with Colin Kydd Campbell and Rengang Chen, VOL. 25,  NO. 2, June 2003

2001   "Interfacial Fracture Toughness for Delamination Growth Prediction in a Novel Peripheral Array Package"by Suresh Sitaraman, Viswanathan Sundararaman, VOL. 24, NO. 2, June 2003  

 

Transactions on Advanced Packaging Best Paper Award Recipients

2010   “Noise Coupling Mitigation in PWR/GND Plane Pair by Means of Photonic Crystal Fence: Sensitivity Analysis and Design Parameters Extraction” by Antonio Ciccomancini Scogna, Tzong-Lin Wu,VOL. 33, NO. 3, August 2010

2009   "Through-Silicon via Interconnection for 3D Integration Using Room-Temperature Bonding" by Naotaka Tanaka, Yasuhiro Yoshimura, Michihiro Kawashita, Toshihide Uematsu, Chuichi Miyazaki, Norihisa Toma, Kenji Hanada, Masaki Nakanishi, Takahiro Naito, Takafumi Kikuchi, and Takashi Akazawa, VOL. 32, NO. 4, November 2009

And

"Fast Methodology for Determining Eye Diagram Characteristics of Lossy Transmission Lines" by Wei-Da Guo, Jeng-Hau Lin, Chien-Min Lin, Tian-Wei Huang, and Ruey-Beei Wu, VOL. 32, NO. 1, February 2009

2008   “Accurate System Voltage and Timing Margin Simulation in High-Speed I/O System Designs”, Kyung Suk (Dan) Oh, Frank Lambrecht, Sam Chang, Qi Lin, Jihong Ren, Chuck Yuan, Jared Zerbe, Vladimir Stojanovic, VOL. 31, NO. 4, November 2008

2007   “Quilt Packaging: High-Density, High-Speed Interchip Communications,” by Gary H. Bernstein, Qing Liu, Minjun Yan, Zhuowen Sun, David Kopp, Wolfgang Porod, Greg Snider and Patrick Fay, VOL. 30, NO. 4, November 2007

 And

          “Stability, Causality, and Passivity in Electrical Interconnect Models,” by Piero Triverio, Stefano Grivet-Talocia, Flavio G. Canavero, Michel S. Nakhla,  Ramachandra Achar, VOL. 30, NO. 4, November 2007

 

2006   “Novel method for simultaneous formation of wires and vias of a printed circuit board using nanoporous body” by Koji Asakawa, Shigeru Matake, Yasuyuki Hotta and Toshiro Hiraoka, VOL. 29, NO. 2, May 2006

2005   No award given

2004   “Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages” by Eric Stellrecht, Bongtae Han, Michael G. Pecht, VOL. 27, NO. 3, September 2004

2003   "High-Density 3D Packaging Technology for CCD Micro-Camera System Module"  by Hiroshi Yamada, Takashi Togasaki, Masanobu Kimura, Hajime Sudo,  VOL. 26, NO. 2, May 2003

 

Transactions on Electronics Packaging Manufacturing Best Paper Award Recipients

2010   “Correlation Between Whisker Initiation and Compressive Stress in Electrodeposited Tin–Copper Coating on Copper Leadframes” by Takahiko Kato, Haruo Akahoshi, Masato Nakamura, Takeshi Terasaki, Tomio Iwasaki, Tomoaki Hashimoto, Asao Nishimura, VOL. 33, NO. 3, July 2010

2009   "Fabrication of Molded Interconnection Devices by Ultrasonic Hot Embossing on Thin Polymer Films" by Puttachat Khuntontong, Thomas Blaser, and Werner Karl Schomburg; VOL. 32, NO. 3, July 2009