2016 CPMT Award Recipients
Electronics Manufacturing Technology Award
ASE, Shanghai, China
For pioneering work in development and mass production of new packaging technologies and processes, including the first BGA interconnection, as well as characterization methodologies for reliability evaluation/predication and thermal solutions in semiconductor packaging.
Outstanding Sustained Technical Contribution Award
IBM T. J. Watson Research Center, USA
For outstanding contributions to the fundamental understanding, optimization, and manufacturing implementation of Pb-free solders and contact metal layers for high performance chip interconnects.
Exceptional Technical Achievement Award
Huazhong University of Science and Technology, China
For exceptional contribution in modeling and experimental characterization of IC/LED packaging, focusing primarily on thermal packaging and innovations in packaging processes.
David Feldman Outstanding Contribution Award
Cisco Systems, Inc., USA
For outstanding leadership of the CPMT Society as Vice President and President, with key impact on globalization, industry connections, technical committee revitalization, as well as initiating transformation to prepare the Society for rapid, disruptive changes in the semiconductor and electronics industries.
Regional Contribution Award - Region 8 (Europe, Africa, Middle East)
Budapest University of Technology and Economics, Hungary
For outstanding contributions in promoting electronic packaging and IEEE CPMT networking activities in East Europe and Region 8, including founding the ISSE - International Spring Seminar on Electronics Technology and establishing and developing the IEEE CPMT Hungary-Romania Joint Chapter.
Regional Contribution Award - Region 10 (Asia & Pacific)
FUJIKURA Ltd., Japan
For contributions to the reconstruction and activation of the CPMT Japan Chapter as Vice Chair and Chair, and leadership in electronics and photonics packaging technologies development in Japan.