Bio Aschenbrenner

ROLF ASCHENBRENNER (M'97, SM '04) received the B.S. degree in mechanical engineering from the University for Applied Science, Gießen, Germany, in 1986 and the M.S. degree in physics from the University of Gießen, Germany, in 1991.

 From 1991 to 1992 he worked at the University of Gießen in the area of new materials and was engaged in a project for the German Space Lab Mission D2.

 In 1993 he joined the Research Center for Microperipheric Technologies at the Technical University of Berlin, working in the area of electroless metal deposition. Since March 1994 he has been employed at the Fraunhofer Institute for Reliability and Microintegration Berlin (IZM) and from 2000 until 2006 he was Deputy Director of the IZM. He is presently department head of the largest department of the Fraunhofer IZM “System Integration and Interconnections Technologies”.

 Rolf Aschenbrenner's research work has spanned from manufacturing process fundamentals in adhesive joining to applied manufacturing problems.

 Broadening his research contributions beyond those are made in thin and flexible electronic assemblies and development and analysis of innovative process technologies for all aspects of system level packaging.

 He has authored and co-authored more than 100 articles in journals or proceedings in the area of electronic packaging and he holds more than 14 patents in the field of microelectronic packaging. In 1995 he obtained the Best Paper Award as the main author from the Surface Mount International Conference (SMI) in San Jose. He also co-authored a number of papers that received Best Paper Awards.

In January 2005 he received the “iNEMI International Recognition Award” which was presented during the Fraunhofer Packaging Day.

In terms of professional services, Rolf Aschenbrenner has taken roles as a member of the Board of Governors for the IEEE CPMT Society. Until spring 2009 he was also a member of the Board of IMAPS Germany.

 He was General Chair of the first International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic) in 2001. In 2000 he was the Program Chair of the European VLSI Packaging Workshop in 2001 and of the IEEE European System Packaging Workshop. He also served as a member on several technical committees including ISEPT, Materials Conference, Adhesives in Electronics, EMAP, EPTC, Interpack and Electronic Goes Green. Rolf Aschenbrenner was the General Chair of the ESTC 2010, which took place in Berlin in September 2010.

He has been member of the Conference Committees of the China SMT Forum since 2007 and of the Smart System Integration since 2006. He also forms member of the International Advisory Board of the IMPACT and of the ICEPT-HDP Advisory Committee.

 As a member of the IEEE CPMT Society Board of Governors Rolf Aschenbrenner has worked as a European representative on the Conference Advisory Board Committee, and has played an active role in the globalization of IEEE CPMT in terms of membership and chapter development. He was Technical Vice President and has recently become a Senior Member of IEEE. From 2005-2009 he was Vice President Conferences and from January 2010 until December 2011 he was IEEE CPMT President.