Bio Aoyagi

MASAHIRO AOYAGI (M’94,SM’10) received the Bachelor of Engineering in Electronic Engineering from Nagoya Institute of Technology, Nagoya, Japan, in 1982; and the Doctor of Engineering degree in Electronic Engineering from Nagoya Institute of Technology, in 1992.

 He joined Electrotechnical Laboratory (ETL), Tsukuba, Japan  in 1982, where he was engaged in the research and development of Nb, NbN superconducting devices and Josephson integrated circuits until 1994, for establishing Josephson Computer Technology.  He was engaged in that of high speed signal measurement technology until 2000.  He worked in opto-electronic sampling measurement technology as a guest researcher in National Physical Laboratory (NPL), Teddington, UK, from 1994 to 1995.  ETL was reorganized into National Institute of Advanced Industrial Science and Technology (AIST) in 2000.  He became a group leader of High Density Interconnection Group, Nanoelectronics Research Institute (NeRI), AIST.  He worked as a group leader specified for fundamental 3D LSI chip stacking technology in the national R&D project of High Density Electronic System Integration from 1999 to 2004.  He was a team leader of Opto-Electronic System Integration Collaborative Research Team, NeRI, from 2004 to 2009.  He has been a principal research scientist of NeRI  since 2009.  His present research field is high-speed high-density electronic packaging and interconnection technology including 3D LSI chip stacking and opto-electronic hybrid packaging.

 Masahiro Aoyagi was awarded the Tsukuba prize of 1991 for the development of Josephson prototype computer ETL-JC1.  He has authored or co-authored 225 technical papers and has 80 patents.

 Masahiro Aoyagi has been an IEEE CPMT member since 1998.  He has been involved in the technical committee of Electronics Packaging Technology Conference (EPTC) held in Singapore and International Conference of Electronic Packaging (ICEP) held in Japan.  He was the chair of IEEE CPMT Japan Chapter from 2009 to 2010.

 Masahiro Aoyagi holds memberships in Institution of Engineering and Technology (IET), International Microelectronics and Packaging Society (IMAPS), Society of Photo-Optical Instrumentation Engineers (SPIE), Institute of Electronics Information and Communication Engineers (IEICE), Japan Institute of Electronics Packaging (JIEP), Institute of Electrical Engineers of Japan (IEEJ), and Japan Society of Applied Physics (JSAP).