IEEE CPMT Society has changed its name to the IEEE Electronics Packaging Society.
Watch for updates and ways you can help support the change.

2017 IEEE Holm Conference on Electrical Contacts Denver, CO USA Sep 10, 2017 - Sep 13, 2017
2017 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 20, 2017 - Nov 22, 2017
2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI) Brest, France May 22, 2018 - May 25, 2018
2018 7th Electronic System-Integration Technology Conference (ESTC) Dresden, Germany Sep 18, 2018 - Sep 21, 2018
2018 IEEE Holm Conference on Electrical Contacts Albuquerque, NM USA Oct 14, 2018 - Oct 18, 2018
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 25, 2019 - Jun 2, 2019
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2018 IEEE 68th Electronic Components and Technologies Conference (ECTC) San Diego, CA USA May 29, 2018 - Jun 1, 2018 Abstract Submission Date: Oct 16, 2017

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photo Ho photo Tu

Recipients of 2017

     Paul S Ho and King-Ning Tu

         An IEEE Fellow, Ho is director of the Laboratory for Interconnect and Packaging at the University of Texas at Austin, Austin, TX, USA. Tu is the TSMC Chair Professorat National Chiao TungUniversity, Hsinchu, Taiwan.

For contributions to the
materials science of
packaging and its impact
on reliability, specifically in
the science of electromigration

63rd IEEE Holm Conference on Electrical Contacts

10-13th September, 2017

Denver, CO USA




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