IEEE CPMT Society has changed its name to the IEEE Electronics Packaging Society.
Watch for updates and ways you can help support the change.
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Toulouse, France Apr 15, 2018 - Apr 18, 2018 Abstract Submission Date: Oct 1, 2017
2018 IEEE 68th Electronic Components and Technologies Conference (ECTC) San Diego, CA USA May 29, 2018 - Jun 1, 2018 Abstract Submission Date: Oct 16, 2017
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SOCIETY NAME CHANGE TO IEEE ELECTRONICS PACKAGING SOCIETY APPROVED
- Recordings and Files Posted -
IEEE CPMT Award
Paul S Ho and King-Ning Tu
An IEEE Fellow, Ho is director of the Laboratory for Interconnect and Packaging at the University of Texas at Austin, Austin, TX, USA. Tu is the TSMC Chair Professorat National Chiao TungUniversity, Hsinchu, Taiwan.
For contributions to the
materials science of
packaging and its impact
on reliability, specifically in
the science of electromigration