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2014 Electronic System-Integration Technology Conference (ESTC)
Helsinki, Finland Sep 16, 2014 - Sep 18, 2014
2014 20th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Greenwich, London, United Kingdom Sep 24, 2014 - Sep 26, 2014
2014 IEEE 60th Holm Conference on Electrical Contacts (Holm)
New Orleans, LA USA Oct 8, 2014 - Oct 15, 2014
2014 IEEE CPMT Symposium Japan (ICSJ)
Kyoto, Japan Nov 4, 2014 - Nov 6, 2014
2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Saratoga Springs, NY USA May 3, 2015 - May 6, 2015
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)
Berlin, Germany May 10, 2015 - May 13, 2015
2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
San Diego, CA USA May 26, 2015 - May 29, 2015
2015 IEEE 61st Holm Conference on Electrical Contacts (Holm 2015)
San Diego, CA USA Oct 11, 2015 - Oct 14, 2015
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
Las Vegas, NV USA May 28, 2016 - Jun 5, 2016
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
Las Vegas, NV USA May 25, 2019 - Jun 2, 2019
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Saratoga Springs, NY USA May 3, 2015 - May 6, 2015 Abstract Submission Date: Oct 31, 2014
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)
Berlin, Germany May 10, 2015 - May 13, 2015 Abstract Submission Date: Jan 31, 2015
2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
San Diego, CA USA May 26, 2015 - May 29, 2015 Abstract Submission Date: Oct 13, 2014

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Advanced Packaging for High Power LEDs

2014 IEEE CPMT Award

cohen

Recipient of 2014
IEEE CPMT Award

Avram Bar-Cohen

Distinguished University Professor of Mechanical Engineering
University of Maryland, College Park, USA

“For contributions through leadership, education, and advocacy to thermal design, modeling, and analysis of electronic components, and for original research on heat transfer and liquid-phase cooling.”

September 2014

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