2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Honolulu, HI USA Dec 14, 2016 - Dec 16, 2016
2017 Pan Pacific Microelectronics Symposium (Pan Pacific) Kauai, HI USA Feb 6, 2017 - Feb 9, 2017
2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Delft, Netherlands Apr 5, 2017 - Apr 7, 2017
2017 IEEE 21st Workshop on Signal and Power Integrity (SPI) Baveno (VB), Italy May 7, 2017 - May 10, 2017
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Saratoga Springs, NY USA May 15, 2017 - May 18, 2017
2017 IEEE Holm Conference on Electrical Contacts CO, USA Oct 1, 2017 - Oct 4, 2017
2018 IEEE Holm Conference on Electrical Contacts Albuquerque, NM USA Oct 14, 2018 - Oct 18, 2018
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 25, 2019 - Jun 2, 2019
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2017 7th IEEE International Workshop on Advances in Sensors and Interfaces (IWASI) Vieste, Italy Jun 15, 2017 - Jun 16, 2017 Abstract Submission Date: May 1, 2017

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IEEE CPMT Award

Photo Pecht 2016 

Recipient of 2016
IEEE CPMT Award

 MICHAEL PECHT

Director, Center for Advanced
Life Cycle Engineering
University of Maryland, USA
 
For visionary leadership in the
development of physics-of-failure-based
and prognostics-based approaches to
electronic packaging reliability