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2014 IEEE 18th Workshop on Signal and Power Integrity (SPI)
Ghent, Belgium May 11, 2014 - May 14, 2014
2014 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Saratoga Springs, NY USA May 19, 2014 - May 21, 2014
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
Orlando, FL USA May 27, 2014 - May 30, 2014
2014 IEEE Semiconductor Wafer Test Workshop (SWTW 2014)
San Diego, CA USA Jun 6, 2014 - Jun 11, 2014
2014 Electronic System-Integration Technology Conference (ESTC)
Helsinki, Finland Sep 16, 2014 - Sep 18, 2014
2014 IEEE 60th Holm Conference on Electrical Contacts (Holm)
New Orleans, LA USA Oct 8, 2014 - Oct 15, 2014
2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
San Diego, CA USA Jun 26, 2015 - Jun 29, 2015
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
Las Vegas, NV USA May 28, 2016 - Jun 5, 2016
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
Las Vegas, NV USA May 25, 2019 - Jun 2, 2019
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2014 IEEE/CPMT TC-7 Workshop on Accelerated Stress Testing & Reliability (ASTR)
TBD, MN USA Sep 10, 2014 - Sep 12, 2014 Abstract Submission Date: Apr 30, 2014
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Taipei, Taiwan Oct 22, 2014 - Oct 24, 2014 Abstract Submission Date: Jun 15, 2014
2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS)
Portland, OR USA Oct 26, 2014 - Oct 29, 2014 Abstract Submission Date: Jul 1, 2014
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)
Bangalore, India Dec 14, 2014 - Dec 16, 2014 Abstract Submission Date: Aug 31, 2014

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           Deadline 31 March 2014


    

 


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Advanced Packaging for High Power LEDs

2014 IEEE CPMT Award

cohen

Recipient of 2014
IEEE CPMT Award

Avram Bar-Cohen

Distinguished University Professor of Mechanical Engineering
University of Maryland, College Park, USA

“For contributions through leadership, education, and advocacy to thermal design, modeling, and analysis of electronic components, and for original research on heat transfer and liquid-phase cooling.”

September 2014

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