2016 12th International Congress Molded Interconnect Devices (MID) Würzburg, Germany Sep 28, 2016 - Sep 29, 2016
2016 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 7, 2016 - Nov 9, 2016
2016 IEEE International 3D Systems Integration Conference (3DIC) San Francisco, CA USA Nov 8, 2016 - Nov 11, 2016
2016 FUTURECAR: New Era of Automotive Electronics Workshop Atlanta, GA USA Nov 9, 2016 - Nov 10, 2016
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Singapore, Singapore Nov 30, 2016 - Dec 3, 2016
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Honolulu, HI USA Dec 14, 2016 - Dec 16, 2016
2017 Pan Pacific Microelectronics Symposium (Pan Pacific) Kauai, HI USA Feb 6, 2017 - Feb 9, 2017
2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Delft, Netherlands Apr 5, 2017 - Apr 7, 2017
2017 IEEE 21st Workshop on Signal and Power Integrity (SPI) Baveno (VB), Italy May 7, 2017 - May 10, 2017
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Saratoga Springs, NY USA May 15, 2017 - May 18, 2017
2017 IEEE Holm Conference on Electrical Contacts CO, USA Oct 1, 2017 - Oct 4, 2017
2018 IEEE Holm Conference on Electrical Contacts Albuquerque, NM USA Oct 14, 2018 - Oct 18, 2018
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 25, 2019 - Jun 2, 2019
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Delft, Netherlands Apr 5, 2017 - Apr 7, 2017 Abstract Submission Date: Nov 18, 2016
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Saratoga Springs, NY USA May 15, 2017 - May 18, 2017 Abstract Submission Date: Oct 17, 2016
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) Orlando, FL USA May 30, 2017 - Jun 2, 2017 Abstract Submission Date: Oct 10, 2016

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IEEE CPMT Award

Photo Pecht 2016 

Recipient of 2016
IEEE CPMT Award

 MICHAEL PECHT

Director, Center for Advanced
Life Cycle Engineering
University of Maryland, USA
 
For visionary leadership in the
development of physics-of-failure-based
and prognostics-based approaches to
electronic packaging reliability